with that size, the molding compound possibly below minimum thickness  
(2.3 mm square)... most likely, wlp kind of stuff - under molding to  
save diamond saw for cutting... just a guess.
jk
On Aug 2, 2018, at 1:48 PM, David Hillman wrote:

> Hi Graham - other than the bad sunburn jokes you will get on this,  
> why is
> there a concern for UV exposure?
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
> On Thu, Aug 2, 2018 at 12:34 PM, Graham Collins  
> <[log in to unmask]>
> wrote:
>
>> Hello TechNet!
>>
>> I've got a customer who is looking to protect an IC from exposure  
>> to UV.
>> It is a tiny 24 ball BGA (2.3 mm square).  They are suggesting a  
>> dam and
>> glob-top solution, but I'm concerned that there isn't enough room  
>> around it
>> (very, very small board).  I've suggested a dab of black conformal  
>> coating
>> material on a brush.  Any other great solutions?
>>
>> --
>> Graham Collins
>> Senior Process Engineer
>> Sunsel Systems
>> (902) 444-7867
>>