TECHNET Archives

August 2018

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Thu, 2 Aug 2018 14:24:19 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines)
Aluminum foil tape?  EMI shielding tape?  do you have Z-axis contact  
risk if Al metal surface in contact with conductor?  good luck.
jk
On Aug 2, 2018, at 1:34 PM, Graham Collins wrote:

> Hello TechNet!
>
> I've got a customer who is looking to protect an IC from exposure  
> to UV.  It is a tiny 24 ball BGA (2.3 mm square).  They are  
> suggesting a dam and glob-top solution, but I'm concerned that  
> there isn't enough room around it (very, very small board).  I've  
> suggested a dab of black conformal coating material on a brush.   
> Any other great solutions?
>
> -- 
> Graham Collins
> Senior Process Engineer
> Sunsel Systems
> (902) 444-7867

ATOM RSS1 RSS2