Hi folks - the ASTM E3 specification would be applicable for the cross
sectioning of surface finishes. XRF analysis can also be conducted if the
proper certified standards are used.

Dave Hillman
Rockwell Collins
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On Wed, Aug 29, 2018 at 3:00 PM, SALA GABRIELE <[log in to unmask]> wrote:

> Just in advance, it seems IPC-9241 does not mention about Back Plating...
>
> Gabriele
>
> -----Messaggio originale-----
> Da: TechNet [mailto:[log in to unmask]] Per conto di Stadem, Richard D
> Inviato: mercoledì 29 agosto 2018 21:36
> A: [log in to unmask]
> Oggetto: Re: [TN] Thin gold cross section measurement
>
> There is an excellent IPC standard, IPC-9241 Guidelines for Microsection
> Preparation, but I cannot remember if it discusses Back Plating and I do
> not
> have a copy here in front of me. When I get back Monday I will check.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of
> [log in to unmask]
> Sent: Wednesday, August 29, 2018 1:53 PM
> To: [log in to unmask]
> Subject: [TN] Thin gold cross section measurement
> Importance: High
>
> Fellow TechNetters:
>
>    Is there an IPC Standard and/or guideline line which stats or recommend
> that if thin gold plating is to be measured by cross section then Back
> Plating Process should be conducted.
>
>
> Victor,
>
>
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