Hello Eray,

According to the policies and procedures document, you have to contact your CIT or MIT.
This would be your first line contact for questions about IPC-A-610!

Regards, Ramon

(Send on The road with iPhone)

> Op 18 jul. 2018 om 17:40 heeft SALA GABRIELE <[log in to unmask]> het volgende geschreven:
> 
> Hi Eray,
> 
> your interpretation is correct.
> 
> Gabriele
> 
> -----Messaggio originale-----
> Da: TechNet [mailto:[log in to unmask]] Per conto di Eray CANLI
> Inviato: mercoledì 18 luglio 2018 15:59
> A: [log in to unmask]
> Oggetto: [TN] IPC-A-610 Board-in-Board Class 3 Acceptability
> 
> Dear TechNetters,
> 
> This is my first post on TN, and it is nice to be part of this list.
> 
> I have a confusion on "Supported Holes - Board in Board" part of IPC-A-610 document. How should we interpret the statement "No board in board criteria have been established for Class 3 assemblies". Not sure if IPC forbids board-in-board solder assembly in Class 3.
> 
> Should we avoid vertical assembly of boards to each other (without
> connector) in Class 3 designs, or develop our own acceptability criteria?
> 
> Thanks in advance!
> Eray CANLI
> 
> 
> ---
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