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Subject:
R: [TN] IPC-A-610 Board-in-Board Class 3 Acceptability
From:
SALA GABRIELE <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, SALA GABRIELE <[log in to unmask]>
Date:
Wed, 18 Jul 2018 17:40:25 +0200
Content-Type:
text/plain
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text/plain (29 lines) 
Hi Eray,

your interpretation is correct.

Gabriele

-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]] Per conto di Eray CANLI
Inviato: mercoledì 18 luglio 2018 15:59
A: [log in to unmask]
Oggetto: [TN] IPC-A-610 Board-in-Board Class 3 Acceptability

Dear TechNetters,

This is my first post on TN, and it is nice to be part of this list.

I have a confusion on "Supported Holes - Board in Board" part of IPC-A-610 document. How should we interpret the statement "No board in board criteria have been established for Class 3 assemblies". Not sure if IPC forbids board-in-board solder assembly in Class 3.

Should we avoid vertical assembly of boards to each other (without
connector) in Class 3 designs, or develop our own acceptability criteria?

Thanks in advance!
Eray CANLI


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