Dear TechNetters,
This is my first post on TN, and it is nice to be part of this list.
I have a confusion on "Supported Holes - Board in Board" part of IPC-A-610
document. How should we interpret the statement "No board in board criteria
have been established for Class 3 assemblies". Not sure if IPC forbids
board-in-board solder assembly in Class 3.
Should we avoid vertical assembly of boards to each other (without
connector) in Class 3 designs, or develop our own acceptability criteria?
Thanks in advance!
Eray CANLI