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June 2018

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Subject:
Re: Passive component downsizing
From:
Nigel Burtt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Nigel Burtt <[log in to unmask]>
Date:
Tue, 26 Jun 2018 10:03:31 -0500
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Steve

tombstones/drawbridges and/or mid-chip solder beads would be my guess too depending on combination of part, land footprint and stencil aperture. I can see a trial PCB and a DoE needed if this is a road we need to go down

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