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Subject:	Re: Passive component downsizing
From:	"Stadem, Richard D" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D
Date:	Tue, 26 Jun 2018 14:29:19 +0000
Content-Type:	text/plain
Parts/Attachments:	text/plain (1 lines)

And that brings up the other question in my mind; you CAN buy a '57 Chevy! New! There are so many aftermarket companies selling new replacement parts, as well as entire kits of almost any car you wish to build, for a price. 

So just how long do you think it will be before somebody steps up to fill the demand for any given part size? What's stopping them from fabricating them by tomorrow? And if they can do that, why aren't they? There is certainly no shortage of carbon, germanium, copper, epoxy, etc., etc,. If the trend is towards smaller part sizes, but yet there exists a need for larger part sizes, it is only a matter of (a very short) time before that need is met, albeit at slightly higher prices due to lesser volume demand. But the markets are self-limiting. Supply WILL follow demand, eventually.

dean



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Nutting, Phil

Sent: Tuesday, June 26, 2018 8:58 AM

To: [log in to unmask]

Subject: Re: [TN] Passive component downsizing



We were notified many "common" 0603 MLCCs were going to 52 week lead times.  The world is going to smaller packaging.  Ok, so how do I make 20 kilowatts with 0402 parts?  We work in brute force, 1,200 volts at 100 amps, and still use thru hole parts because they can handle the power.  I can see it now, we will use fifty 0201 resistors to get the power level we need.  Geesh!



It is going to be interesting how we build in a world of smaller parts.



I know, you can't buy a '57 Chevy new anymore.  But imagine if you could  Cool!



Phil



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Nigel Burtt

Sent: Tuesday, June 26, 2018 9:48 AM

To: [log in to unmask]

Subject: Re: [TN] Passive component downsizing



Of course, hence "...suitably limited implementation..." in my post.



I'm thinking of assembly problems: printing, SPI, placement, reflow, AOI etc -  even if one could come up with a suitable mixed footprint stencil aperture, would the resulting solder joint meet IPC-A-610 visual inspection acceptability conditions for example.



Then there is the in-service-reliability aspect of the solder joints

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