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June 2018

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From:
"Nutting, Phil" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Nutting, Phil
Date:
Tue, 26 Jun 2018 13:58:11 +0000
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We were notified many "common" 0603 MLCCs were going to 52 week lead times.  The world is going to smaller packaging.  Ok, so how do I make 20 kilowatts with 0402 parts?  We work in brute force, 1,200 volts at 100 amps, and still use thru hole parts because they can handle the power.  I can see it now, we will use fifty 0201 resistors to get the power level we need.  Geesh!



It is going to be interesting how we build in a world of smaller parts.



I know, you can't buy a '57 Chevy new anymore.  But imagine if you could  Cool!



Phil



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Nigel Burtt

Sent: Tuesday, June 26, 2018 9:48 AM

To: [log in to unmask]

Subject: Re: [TN] Passive component downsizing



Of course, hence "...suitably limited implementation..." in my post.



I'm thinking of assembly problems: printing, SPI, placement, reflow, AOI etc -  even if one could come up with a suitable mixed footprint stencil aperture, would the resulting solder joint meet IPC-A-610 visual inspection acceptability conditions for example.



Then there is the in-service-reliability aspect of the solder joints


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