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June 2018

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Subject:
Re: Under fill
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Sat, 9 Jun 2018 17:05:40 -0400
Content-Type:
text/plain
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text/plain (12 lines) 
one more thing, if it is RF device, you might have to worry more: you  
can't use silicon data - most likely it is GaAs... you also need to  
worry about heat dissipation effect if you underfill...
just a thought.. FYI only.
jk
On Jun 9, 2018, at 11:11 AM, haviv gendelis wrote:

> Are there any rules for types of component to be under filled, for  
> high reliability application?
>
> Sent from my iPad

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