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June 2018

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From:
haviv gendelis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, haviv gendelis <[log in to unmask]>
Date:
Sun, 10 Jun 2018 15:21:21 +0300
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thanks

On 10 June 2018 at 00:05, Yuan-chia Joyce Koo <[log in to unmask]> wrote:

> one more thing, if it is RF device, you might have to worry more: you
> can't use silicon data - most likely it is GaAs... you also need to worry
> about heat dissipation effect if you underfill...
> just a thought.. FYI only.
> jk
> On Jun 9, 2018, at 11:11 AM, haviv gendelis wrote:
>
> Are there any rules for types of component to be under filled, for high
>> reliability application?
>>
>> Sent from my iPad
>>
>


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