one more thing, if it is RF device, you might have to worry more: you
can't use silicon data - most likely it is GaAs... you also need to
worry about heat dissipation effect if you underfill...
just a thought.. FYI only.
jk
On Jun 9, 2018, at 11:11 AM, haviv gendelis wrote:
> Are there any rules for types of component to be under filled, for
> high reliability application?
>
> Sent from my iPad