TECHNET Archives

May 2018

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 24 May 2018 10:50:13 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (16 lines)
Particularly, with low k type of dielectric, any compression will potentially change performance. (air pockets used to lower the dielectric constance for over all... this including some of the Teflon based stuff, IMHO)

Sent from my BlackBerry 10 smartphone.
  Original Message  
From: [log in to unmask]
Sent: Thursday, May 24, 2018 10:28
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: [TN] Match Pair Wires with ground shield

Fellow TechNetters:

Will the output signals integrity/impedance of match pair wires with ground shield be effective by an external compression force of the harness/bundle?

Victor,

ATOM RSS1 RSS2