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Date: | Wed, 16 May 2018 21:12:10 +0000 |
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Can anyone point me in a good direction to learn more about solderjoint elasticity with SAC305.
We are seeing some issues with BGAs when they smile.
Type 2 fractures and the vendor recommends increasing the solderpaste.
This seems counter intuitive to me.
If it was SnPb I would go back and hunt some of Werner's research.
As it is Lead free I need some direction.
Any help is appreciated,
FNK
Frank N Kimmey CID+
Electrical Engineer/PCB Design
Verifone
1400 W Stanford Ranch Road
Rocklin, CA 95765
T: 916-625-1818
M: 916-833-9877
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