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April 2018

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Subject:
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Thu, 19 Apr 2018 10:11:02 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (232 lines)
good eyes.
On Apr 19, 2018, at 9:45 AM, Fox, Ian wrote:

> If I'm seeing this correctly, isn't there a crack in the laminate  
> at the hole entrance, or is it staining?   Also, is that the  
> contact side for the soldering iron?
>
> -----Original Message-----
> From: TechNet <[log in to unmask]> On Behalf Of Stadem, Richard D
> Sent: 19 April 2018 14:37
> To: [log in to unmask]
> Subject: Re: [TN] R: [TN] R: [TN] PCB failure
>
> Initially, this does NOT appear to be from Z-axis expansion, but  
> rather resin recession. However, that could have been caused by  
> overheating during soldering or rework also.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
> Sent: Thursday, April 19, 2018 8:32 AM
> To: [log in to unmask]
> Subject: Re: [TN] R: [TN] R: [TN] PCB failure
>
> Hi Gil,
>
> Just got into work and I have your image posted:
>
> http://stevezeva.homestead.com/ 
> SmartSelect_20180419-091742_Gaaiho_PDF.jpg
>
> Steve
>
> On Thu, Apr 19, 2018 at 6:29 AM, Zilber Gil <[log in to unmask]>  
> wrote:
>
>> I sent it to Steve.
>> I am also attaching it to this mail, so you can look at it.
>> Thanks,
>> Gil
>>
>>
>>
>> נשלח מסמארטפון ה-Samsung Galaxy שלי.
>>
>>
>> -------- הודעה מקורית --------
>> מאת: [log in to unmask]
>> תאריך: 19.4.2018 14:24 (GMT+01:00)
>> אל: [log in to unmask]
>> נושא: Re: [TN] R: [TN] R: [TN] PCB failure
>>
>> Dell - Internal Use - Confidential
>>
>> Was the photo uploaded to Steve Geogory.   I was not able to open the
>> drive google url link.  Curious to the photo of IPsep.
>>
>> Victor,
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman
>> Sent: Thursday, April 19, 2018 6:57 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] R: [TN] R: [TN] PCB failure
>>
>> Hi Gil - if you have the resources, you should put that cross section
>> in the SEM and look for possible resin smear on the inner layer/ 
>> PTH interface.
>> Resin smear could cause the defect you are seeing.
>>
>> Dave Hillman
>> Rockwell Collins
>> [log in to unmask]
>>
>>
>> On Thu, Apr 19, 2018 at 4:02 AM, Zilber Gil <[log in to unmask]>  
>> wrote:
>>
>>> Thanks
>>> It is a leaded hand soldering of that device. I will check if the
>>> other failed location has hand soldering also. The material is a
>>> high tg material (Isola 370 HR).
>>> Regards,
>>> Gil
>>>
>>>
>>>
>>> נשלח מסמארטפון ה-Samsung Galaxy שלי.
>>>
>>>
>>> -------- הודעה מקורית --------
>>> מאת: SALA GABRIELE <[log in to unmask]>
>>> תאריך: 19.4.2018 10:46 (GMT+01:00)
>>> אל: 'TechNet E-Mail Forum' <[log in to unmask]>, Zilber Gil <
>>> [log in to unmask]>
>>> נושא: R: [TN] R: [TN] PCB failure
>>>
>>> Gil,
>>>
>>> you could show the picture to TNetters by mailing  it to Steve
>>> Gregory [log in to unmask] whom very kindly support us when we need
>>> to attach picture (many thank Steve for you service) so all the
>>> TNetters will see the picture.
>>>
>>> I have seen your picture, yes it is a IPS (Inner Plane Separation)
>>> from PTH.
>>> It may be due to thermal stress in Z assy, but why ?
>>> You made baking to PCB so it should not be a matter of internal over
>>> pressure due to moisture blow-off.
>>>
>>> Or may be too low Tg of laminate or high CTE in Z assy ?
>>> Are you running Lead Free Reflow ?
>>>
>>> Etc...
>>> Gabriele
>>>
>>>
>>> -----Messaggio originale-----
>>> Da: TechNet [mailto:[log in to unmask]] Per conto di Zilber Gil
>>> Inviato: giovedì 19 aprile 2018 10:27
>>> A: [log in to unmask]
>>> Oggetto: Re: [TN] R: [TN] PCB failure
>>>
>>> Thanks Gariele,
>>> The PCB is new, and it was baked before assembly.
>>> Thanks,
>>> Gil
>>>
>>>
>>>
>>> נשלח מסמארטפון ה-Samsung Galaxy שלי.
>>>
>>>
>>> -------- הודעה מקורית --------
>>> מאת: SALA GABRIELE <[log in to unmask]>
>>> תאריך: 19.4.2018 10:07 (GMT+01:00)
>>> אל: [log in to unmask]
>>> נושא: [TN] R: [TN] PCB failure
>>>
>>> Hi Gil,
>>>
>>> did you handled correctly PCB against moisture absorption ? Like
>>> guide lines of IPC-1601A ?
>>> Shelf life of your PCB ?
>>> Any Baking before reflow?
>>>
>>> Gabriele
>>>
>>> PS: no picture is attached
>>>
>>> -----Messaggio originale-----
>>> Da: TechNet [mailto:[log in to unmask]] Per conto di Gil ZIlber
>>> Inviato: giovedì 19 aprile 2018 09:27
>>> A: [log in to unmask]
>>> Oggetto: [TN] PCB failure
>>>
>>> Hello Tech,
>>> We encounter a PCB discontinuing. Cross section shows conductor
>>> separation from TH.
>>> The PCB manufacturer claims it is due to overheating during  
>>> assembly.
>>> To me, it looks like bad PCB manufacturing.
>>> Please look at the picture and give me your feedback.
>>> Thank you
>>>
>>>
>>> ---
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>>>
>>>
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>>>
>>>
>> The information contained in this communication is proprietary to
>> Israel Aerospace Industries Ltd. and/or third parties, may contain
>> confidential or privileged information, and is intended only for the
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>>
>>
>
>
> --
> Steve Gregory
> Kimco Design and Manufacturing
> Process Engineer
> (208) 322-0500 Ext. -3133
>
> -- 
>
>
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