TECHNET Archives

April 2018

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Fox, Ian" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Fox, Ian
Date:
Thu, 19 Apr 2018 13:45:53 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines)
If I'm seeing this correctly, isn't there a crack in the laminate at the hole entrance, or is it staining?   Also, is that the contact side for the soldering iron?



-----Original Message-----

From: TechNet <[log in to unmask]> On Behalf Of Stadem, Richard D

Sent: 19 April 2018 14:37

To: [log in to unmask]

Subject: Re: [TN] R: [TN] R: [TN] PCB failure



Initially, this does NOT appear to be from Z-axis expansion, but rather resin recession. However, that could have been caused by overheating during soldering or rework also.



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory

Sent: Thursday, April 19, 2018 8:32 AM

To: [log in to unmask]

Subject: Re: [TN] R: [TN] R: [TN] PCB failure



Hi Gil,



Just got into work and I have your image posted:



http://stevezeva.homestead.com/SmartSelect_20180419-091742_Gaaiho_PDF.jpg



Steve



On Thu, Apr 19, 2018 at 6:29 AM, Zilber Gil <[log in to unmask]> wrote:



> I sent it to Steve.

> I am also attaching it to this mail, so you can look at it.

> Thanks,

> Gil

>

>

>

> נשלח מסמארטפון ה-Samsung Galaxy שלי.

>

>

> -------- הודעה מקורית --------

> מאת: [log in to unmask]

> תאריך: 19.4.2018 14:24 (GMT+01:00)

> אל: [log in to unmask]

> נושא: Re: [TN] R: [TN] R: [TN] PCB failure

>

> Dell - Internal Use - Confidential

>

> Was the photo uploaded to Steve Geogory.   I was not able to open the

> drive google url link.  Curious to the photo of IPsep.

>

> Victor,

>

> -----Original Message-----

> From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman

> Sent: Thursday, April 19, 2018 6:57 AM

> To: [log in to unmask]

> Subject: Re: [TN] R: [TN] R: [TN] PCB failure

>

> Hi Gil - if you have the resources, you should put that cross section 

> in the SEM and look for possible resin smear on the inner layer/PTH interface.

> Resin smear could cause the defect you are seeing.

>

> Dave Hillman

> Rockwell Collins

> [log in to unmask]

>

>

> On Thu, Apr 19, 2018 at 4:02 AM, Zilber Gil <[log in to unmask]> wrote:

>

> > Thanks

> > It is a leaded hand soldering of that device. I will check if the 

> > other failed location has hand soldering also. The material is a 

> > high tg material (Isola 370 HR).

> > Regards,

> > Gil

> >

> >

> >

> > נשלח מסמארטפון ה-Samsung Galaxy שלי.

> >

> >

> > -------- הודעה מקורית --------

> > מאת: SALA GABRIELE <[log in to unmask]>

> > תאריך: 19.4.2018 10:46 (GMT+01:00)

> > אל: 'TechNet E-Mail Forum' <[log in to unmask]>, Zilber Gil < 

> > [log in to unmask]>

> > נושא: R: [TN] R: [TN] PCB failure

> >

> > Gil,

> >

> > you could show the picture to TNetters by mailing  it to Steve 

> > Gregory [log in to unmask] whom very kindly support us when we need 

> > to attach picture (many thank Steve for you service) so all the 

> > TNetters will see the picture.

> >

> > I have seen your picture, yes it is a IPS (Inner Plane Separation) 

> > from PTH.

> > It may be due to thermal stress in Z assy, but why ?

> > You made baking to PCB so it should not be a matter of internal over 

> > pressure due to moisture blow-off.

> >

> > Or may be too low Tg of laminate or high CTE in Z assy ?

> > Are you running Lead Free Reflow ?

> >

> > Etc...

> > Gabriele

> >

> >

> > -----Messaggio originale-----

> > Da: TechNet [mailto:[log in to unmask]] Per conto di Zilber Gil

> > Inviato: giovedì 19 aprile 2018 10:27

> > A: [log in to unmask]

> > Oggetto: Re: [TN] R: [TN] PCB failure

> >

> > Thanks Gariele,

> > The PCB is new, and it was baked before assembly.

> > Thanks,

> > Gil

> >

> >

> >

> > נשלח מסמארטפון ה-Samsung Galaxy שלי.

> >

> >

> > -------- הודעה מקורית --------

> > מאת: SALA GABRIELE <[log in to unmask]>

> > תאריך: 19.4.2018 10:07 (GMT+01:00)

> > אל: [log in to unmask]

> > נושא: [TN] R: [TN] PCB failure

> >

> > Hi Gil,

> >

> > did you handled correctly PCB against moisture absorption ? Like 

> > guide lines of IPC-1601A ?

> > Shelf life of your PCB ?

> > Any Baking before reflow?

> >

> > Gabriele

> >

> > PS: no picture is attached

> >

> > -----Messaggio originale-----

> > Da: TechNet [mailto:[log in to unmask]] Per conto di Gil ZIlber

> > Inviato: giovedì 19 aprile 2018 09:27

> > A: [log in to unmask]

> > Oggetto: [TN] PCB failure

> >

> > Hello Tech,

> > We encounter a PCB discontinuing. Cross section shows conductor 

> > separation from TH.

> > The PCB manufacturer claims it is due to overheating during assembly.

> > To me, it looks like bad PCB manufacturing.

> > Please look at the picture and give me your feedback.

> > Thank you

> >

> >

> > ---

> > Questa e-mail è stata controllata per individuare virus con Avast 

> > antivirus.

> > https://www.avast.com/antivirus

> > The information contained in this communication is proprietary to 

> > Israel Aerospace Industries Ltd. and/or third parties, may contain 

> > confidential or privileged information, and is intended only for the 

> > use of the intended addressee thereof. If you are not the intended 

> > addressee, please be aware that any use, disclosure, distribution 

> > and/or copying of this communication is strictly prohibited. If you 

> > receive this communication in error, please notify the sender

> immediately and delete it from your computer.

> >

> >

> > The information contained in this communication is proprietary to 

> > Israel Aerospace Industries Ltd. and/or third parties, may contain 

> > confidential or privileged information, and is intended only for the 

> > use of the intended addressee thereof. If you are not the intended 

> > addressee, please be aware that any use, disclosure, distribution 

> > and/or copying of this communication is strictly prohibited. If you 

> > receive this communication in error, please notify the sender

> immediately and delete it from your computer.

> >

> >

> The information contained in this communication is proprietary to 

> Israel Aerospace Industries Ltd. and/or third parties, may contain 

> confidential or privileged information, and is intended only for the 

> use of the intended addressee thereof. If you are not the intended 

> addressee, please be aware that any use, disclosure, distribution 

> and/or copying of this communication is strictly prohibited. If you 

> receive this communication in error, please notify the sender immediately and delete it from your computer.

>

>





--

Steve Gregory

Kimco Design and Manufacturing

Process Engineer

(208) 322-0500 Ext. -3133



-- 







This email and any attachments are only for use by the intended

recipient(s) and may contain legally privileged,  confidential, proprietary or otherwise private information. Any unauthorized use, reproduction, dissemination, distribution or other disclosure of the contents of this e-mail or its attachments is strictly  prohibited. If you have received this email in error, please notify the  sender immediately and delete the original. 

This e-mail and any attachments may contain confidential or privileged information. If you are not the intended recipient or have received this e-mail in error, please notify the sender immediately by reply of e-mail and destroy all paper and electronic copies of the message.  Please note distribution, disclosure of content or copying of this e-mail is prohibited.



Rolls-Royce Controls Limited may intercept or monitor email traffic, data and also the content of email for operational reasons or for lawful business practices.



Registered office at Moor Lane, PO Box 31, Derby, DE24 8BJ. Company number 6686268. Registered in England

ATOM RSS1 RSS2