It is a through hole. I am checking other evidence for separation on other holes
Thanks,
Gil
נשלח מסמארטפון ה-Samsung Galaxy שלי.
-------- הודעה מקורית --------
מאת: "Fox, Ian" <[log in to unmask]>
תאריך: 19.4.2018 14:34 (GMT+01:00)
אל: TechNet E-Mail Forum <[log in to unmask]>, Zilber Gil <[log in to unmask]>
נושא: RE: [TN] R: [TN] R: [TN] PCB failure
Hi Gil, I think what Dave was suggesting is that if resin smear is the issue, it is unlikely to be confined to that one site on the single hole, so you should see evidence of poor adhesion of the inner layers to the plated hole wall elsewhere on the board. You mention it's a hand soldered joint, SM or through hole?
Regards
Ian Fox
Electronics Materials and Process Specialist
[log in to unmask]
-----Original Message-----
From: TechNet <[log in to unmask]> On Behalf Of Zilber Gil
Sent: 19 April 2018 13:22
To: [log in to unmask]
Subject: Re: [TN] R: [TN] R: [TN] PCB failure
Thanks Dave,
I will do it. But, I am afraid that during the sample preparation, this area is contaminated by the resin used for the metalorgic cross-section. Do you have experience if we can distinguish between the PCB's resin and the sample resin?
Regards,
Gil
נשלח מסמארטפון ה-Samsung Galaxy שלי.
-------- הודעה מקורית --------
מאת: David Hillman <[log in to unmask]>
תאריך: 19.4.2018 13:56 (GMT+01:00)
אל: TechNet E-Mail Forum <[log in to unmask]>, Zilber Gil <[log in to unmask]>
נושא: Re: [TN] R: [TN] R: [TN] PCB failure
Hi Gil - if you have the resources, you should put that cross section in the SEM and look for possible resin smear on the inner layer/PTH interface. Resin smear could cause the defect you are seeing.
Dave Hillman
Rockwell Collins
[log in to unmask]<mailto:[log in to unmask]>
On Thu, Apr 19, 2018 at 4:02 AM, Zilber Gil <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Thanks
It is a leaded hand soldering of that device. I will check if the other failed location has hand soldering also. The material is a high tg material (Isola 370 HR).
Regards,
Gil
נשלח מסמארטפון ה-Samsung Galaxy שלי.
-------- הודעה מקורית --------
מאת: SALA GABRIELE <[log in to unmask]<mailto:[log in to unmask]>>
תאריך: 19.4.2018 10:46 (GMT+01:00)
אל: 'TechNet E-Mail Forum' <[log in to unmask]<mailto:[log in to unmask]>>, Zilber Gil <[log in to unmask]<mailto:[log in to unmask]>>
נושא: R: [TN] R: [TN] PCB failure
Gil,
you could show the picture to TNetters by mailing it to Steve Gregory [log in to unmask]<mailto:[log in to unmask]> whom very kindly support us when we need to attach picture (many thank Steve for you service) so all the TNetters will see the picture.
I have seen your picture, yes it is a IPS (Inner Plane Separation) from PTH.
It may be due to thermal stress in Z assy, but why ?
You made baking to PCB so it should not be a matter of internal over pressure due to moisture blow-off.
Or may be too low Tg of laminate or high CTE in Z assy ?
Are you running Lead Free Reflow ?
Etc...
Gabriele
-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] Per conto di Zilber Gil
Inviato: giovedi 19 aprile 2018 10:27
A: [log in to unmask]<mailto:[log in to unmask]>
Oggetto: Re: [TN] R: [TN] PCB failure
Thanks Gariele,
The PCB is new, and it was baked before assembly.
Thanks,
Gil
נשלח מסמארטפון ה-Samsung Galaxy שלי.
-------- הודעה מקורית --------
מאת: SALA GABRIELE <[log in to unmask]<mailto:[log in to unmask]>>
תאריך: 19.4.2018 10:07 (GMT+01:00)
אל: [log in to unmask]<mailto:[log in to unmask]>
נושא: [TN] R: [TN] PCB failure
Hi Gil,
did you handled correctly PCB against moisture absorption ? Like guide lines of IPC-1601A ?
Shelf life of your PCB ?
Any Baking before reflow?
Gabriele
PS: no picture is attached
-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] Per conto di Gil ZIlber
Inviato: giovedi 19 aprile 2018 09:27
A: [log in to unmask]<mailto:[log in to unmask]>
Oggetto: [TN] PCB failure
Hello Tech,
We encounter a PCB discontinuing. Cross section shows conductor separation from TH.
The PCB manufacturer claims it is due to overheating during assembly. To me, it looks like bad PCB manufacturing.
Please look at the picture and give me your feedback.
Thank you
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