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Subject:
From:
Zilber Gil <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Zilber Gil <[log in to unmask]>
Date:
Thu, 19 Apr 2018 12:32:06 +0000
Content-Type:
text/plain
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text/plain (1 lines)
Thanks for the information,

I will check it with the SEM and we will see.

Regards,

Gil







נשלח מסמארטפון ה-Samsung Galaxy שלי.





-------- הודעה מקורית --------

מאת: David Hillman <[log in to unmask]>

תאריך: 19.4.2018 14:28 (GMT+01:00)

אל: Zilber Gil <[log in to unmask]>

עותק: TechNet E-Mail Forum <[log in to unmask]>

נושא: Re: [TN] R: [TN] R: [TN] PCB failure



Hi Gil - I know when our FA lab is working this type of issue, they can see the difference between the board resin and the cross section potting compound. I do know its a cross section that needs to be prepared carefully as that area can smear if the wrong pressure/grinding/polishing process is not followed.



Dave



On Thu, Apr 19, 2018 at 7:22 AM, Zilber Gil <[log in to unmask]<mailto:[log in to unmask]>> wrote:

Thanks Dave,

I will do it. But, I am afraid that during the sample preparation, this area is contaminated by the resin used for the metalorgic cross-section. Do you have experience if we can distinguish between the PCB's resin and the sample resin?

Regards,

Gil







נשלח מסמארטפון ה-Samsung Galaxy שלי.





-------- הודעה מקורית --------

מאת: David Hillman <[log in to unmask]<mailto:[log in to unmask]>>

תאריך: 19.4.2018 13:56 (GMT+01:00)

אל: TechNet E-Mail Forum <[log in to unmask]<mailto:[log in to unmask]>>, Zilber Gil <[log in to unmask]<mailto:[log in to unmask]>>

נושא: Re: [TN] R: [TN] R: [TN] PCB failure



Hi Gil - if you have the resources, you should put that cross section in the SEM and look for possible resin smear on the inner layer/PTH interface. Resin smear could cause the defect you are seeing.



Dave Hillman

Rockwell Collins

[log in to unmask]<mailto:[log in to unmask]>





On Thu, Apr 19, 2018 at 4:02 AM, Zilber Gil <[log in to unmask]<mailto:[log in to unmask]>> wrote:

Thanks

It is a leaded hand soldering of that device. I will check if the other failed location has hand soldering also. The material is a high tg material (Isola 370 HR).

Regards,

Gil







נשלח מסמארטפון ה-Samsung Galaxy שלי.





-------- הודעה מקורית --------

מאת: SALA GABRIELE <[log in to unmask]<mailto:[log in to unmask]>>

תאריך: 19.4.2018 10:46 (GMT+01:00)

אל: 'TechNet E-Mail Forum' <[log in to unmask]<mailto:[log in to unmask]>>, Zilber Gil <[log in to unmask]<mailto:[log in to unmask]>>

נושא: R: [TN] R: [TN] PCB failure



Gil,



you could show the picture to TNetters by mailing  it to Steve Gregory  [log in to unmask]<mailto:[log in to unmask]> whom very kindly support us when we need to attach picture (many thank Steve for you service) so all the TNetters will see the picture.



I have seen your picture, yes it is a IPS (Inner Plane Separation) from PTH.

It may be due to thermal stress in Z assy, but why ?

You made baking to PCB so it should not be a matter of internal over pressure due to moisture blow-off.



Or may be too low Tg of laminate or high CTE in Z assy ?

Are you running Lead Free Reflow ?



Etc...

Gabriele





-----Messaggio originale-----

Da: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] Per conto di Zilber Gil

Inviato: giovedì 19 aprile 2018 10:27

A: [log in to unmask]<mailto:[log in to unmask]>

Oggetto: Re: [TN] R: [TN] PCB failure



Thanks Gariele,

The PCB is new, and it was baked before assembly.

Thanks,

Gil







נשלח מסמארטפון ה-Samsung Galaxy שלי.





-------- הודעה מקורית --------

מאת: SALA GABRIELE <[log in to unmask]<mailto:[log in to unmask]>>

תאריך: 19.4.2018 10:07 (GMT+01:00)

אל: [log in to unmask]<mailto:[log in to unmask]>

נושא: [TN] R: [TN] PCB failure



Hi Gil,



did you handled correctly PCB against moisture absorption ? Like guide lines of IPC-1601A ?

Shelf life of your PCB ?

Any Baking before reflow?



Gabriele



PS: no picture is attached



-----Messaggio originale-----

Da: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] Per conto di Gil ZIlber

Inviato: giovedì 19 aprile 2018 09:27

A: [log in to unmask]<mailto:[log in to unmask]>

Oggetto: [TN] PCB failure



Hello Tech,

We encounter a PCB discontinuing. Cross section shows conductor separation from TH.

The PCB manufacturer claims it is due to overheating during assembly. To me, it looks like bad PCB manufacturing.

Please look at the picture and give me your feedback.

Thank you





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The information contained in this communication is proprietary to Israel Aerospace Industries Ltd. and/or third parties, may contain confidential or privileged information, and is intended only for the use of the intended addressee thereof. If you are not the intended addressee, please be aware that any use, disclosure, distribution and/or copying of this communication is strictly prohibited. If you receive this communication in error, please notify the sender immediately and delete it from your computer.





The information contained in this communication is proprietary to Israel Aerospace Industries Ltd. and/or third parties, may contain confidential or privileged information, and is intended only for the use of the intended addressee thereof. If you are not the intended addressee, please be aware that any use, disclosure, distribution and/or copying of this communication is strictly prohibited. If you receive this communication in error, please notify the sender immediately and delete it from your computer.





The information contained in this communication is proprietary to Israel Aerospace Industries Ltd. and/or third parties, may contain confidential or privileged information, and is intended only for the use of the intended addressee thereof. If you are not the intended addressee, please be aware that any use, disclosure, distribution and/or copying of this communication is strictly prohibited. If you receive this communication in error, please notify the sender immediately and delete it from your computer.




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