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Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Hillman <[log in to unmask]>
Date:
Thu, 19 Apr 2018 07:28:31 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (159 lines)
Hi Gil - I know when our FA lab is working this type of issue, they can see
the difference between the board resin and the cross section potting
compound. I do know its a cross section that needs to be prepared carefully
as that area can smear if the wrong pressure/grinding/polishing process is
not followed.

Dave

On Thu, Apr 19, 2018 at 7:22 AM, Zilber Gil <[log in to unmask]> wrote:

> Thanks Dave,
> I will do it. But, I am afraid that during the sample preparation, this
> area is contaminated by the resin used for the metalorgic cross-section. Do
> you have experience if we can distinguish between the PCB's resin and the
> sample resin?
> Regards,
> Gil
>
>
>
> נשלח מסמארטפון ה-Samsung Galaxy שלי.
>
>
> -------- הודעה מקורית --------
> מאת: David Hillman <[log in to unmask]>
> תאריך: 19.4.2018 13:56 (GMT+01:00)
> אל: TechNet E-Mail Forum <[log in to unmask]>, Zilber Gil <[log in to unmask]>
>
> נושא: Re: [TN] R: [TN] R: [TN] PCB failure
>
> Hi Gil - if you have the resources, you should put that cross section in
> the SEM and look for possible resin smear on the inner layer/PTH interface.
> Resin smear could cause the defect you are seeing.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
> On Thu, Apr 19, 2018 at 4:02 AM, Zilber Gil <[log in to unmask]> wrote:
>
>> Thanks
>> It is a leaded hand soldering of that device. I will check if the other
>> failed location has hand soldering also. The material is a high tg material
>> (Isola 370 HR).
>> Regards,
>> Gil
>>
>>
>>
>> נשלח מסמארטפון ה-Samsung Galaxy שלי.
>>
>>
>> -------- הודעה מקורית --------
>> מאת: SALA GABRIELE <[log in to unmask]>
>> תאריך: 19.4.2018 10:46 (GMT+01:00)
>> אל: 'TechNet E-Mail Forum' <[log in to unmask]>, Zilber Gil <
>> [log in to unmask]>
>> נושא: R: [TN] R: [TN] PCB failure
>>
>> Gil,
>>
>> you could show the picture to TNetters by mailing  it to Steve Gregory
>> [log in to unmask] whom very kindly support us when we need to attach
>> picture (many thank Steve for you service) so all the TNetters will see the
>> picture.
>>
>> I have seen your picture, yes it is a IPS (Inner Plane Separation) from
>> PTH.
>> It may be due to thermal stress in Z assy, but why ?
>> You made baking to PCB so it should not be a matter of internal over
>> pressure due to moisture blow-off.
>>
>> Or may be too low Tg of laminate or high CTE in Z assy ?
>> Are you running Lead Free Reflow ?
>>
>> Etc...
>> Gabriele
>>
>>
>> -----Messaggio originale-----
>> Da: TechNet [mailto:[log in to unmask]] Per conto di Zilber Gil
>> Inviato: giovedì 19 aprile 2018 10:27
>> A: [log in to unmask]
>> Oggetto: Re: [TN] R: [TN] PCB failure
>>
>> Thanks Gariele,
>> The PCB is new, and it was baked before assembly.
>> Thanks,
>> Gil
>>
>>
>>
>> נשלח מסמארטפון ה-Samsung Galaxy שלי.
>>
>>
>> -------- הודעה מקורית --------
>> מאת: SALA GABRIELE <[log in to unmask]>
>> תאריך: 19.4.2018 10:07 (GMT+01:00)
>> אל: [log in to unmask]
>> נושא: [TN] R: [TN] PCB failure
>>
>> Hi Gil,
>>
>> did you handled correctly PCB against moisture absorption ? Like guide
>> lines of IPC-1601A ?
>> Shelf life of your PCB ?
>> Any Baking before reflow?
>>
>> Gabriele
>>
>> PS: no picture is attached
>>
>> -----Messaggio originale-----
>> Da: TechNet [mailto:[log in to unmask]] Per conto di Gil ZIlber
>> Inviato: giovedì 19 aprile 2018 09:27
>> A: [log in to unmask]
>> Oggetto: [TN] PCB failure
>>
>> Hello Tech,
>> We encounter a PCB discontinuing. Cross section shows conductor
>> separation from TH.
>> The PCB manufacturer claims it is due to overheating during assembly. To
>> me, it looks like bad PCB manufacturing.
>> Please look at the picture and give me your feedback.
>> Thank you
>>
>>
>> ---
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>> notify the sender immediately and delete it from your computer.
>>
>>
>> The information contained in this communication is proprietary to Israel
>> Aerospace Industries Ltd. and/or third parties, may contain confidential or
>> privileged information, and is intended only for the use of the intended
>> addressee thereof. If you are not the intended addressee, please be aware
>> that any use, disclosure, distribution and/or copying of this communication
>> is strictly prohibited. If you receive this communication in error, please
>> notify the sender immediately and delete it from your computer.
>>
>>
> The information contained in this communication is proprietary to Israel
> Aerospace Industries Ltd. and/or third parties, may contain confidential or
> privileged information, and is intended only for the use of the intended
> addressee thereof. If you are not the intended addressee, please be aware
> that any use, disclosure, distribution and/or copying of this communication
> is strictly prohibited. If you receive this communication in error, please
> notify the sender immediately and delete it from your computer.
>

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