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April 2018

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Subject:
From:
SALA GABRIELE <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, SALA GABRIELE <[log in to unmask]>
Date:
Thu, 19 Apr 2018 11:17:33 +0200
Content-Type:
text/plain
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text/plain (98 lines)
It may be you have to review your manual soldering set-up parameters...

Hand soldering is too much man dependable. Operator must be well skilled

BTW let's se comment of other TNs

Gabriele

-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]] Per conto di Zilber Gil
Inviato: giovedì 19 aprile 2018 11:03
A: [log in to unmask]
Oggetto: Re: [TN] R: [TN] R: [TN] PCB failure

Thanks
It is a leaded hand soldering of that device. I will check if the other failed location has hand soldering also. The material is a high tg material (Isola 370 HR).
Regards,
Gil



נשלח מסמארטפון ה-Samsung Galaxy שלי.


-------- הודעה מקורית --------
מאת: SALA GABRIELE <[log in to unmask]>
תאריך: 19.4.2018 10:46 (GMT+01:00)
אל: 'TechNet E-Mail Forum' <[log in to unmask]>, Zilber Gil <[log in to unmask]>
נושא: R: [TN] R: [TN] PCB failure

Gil,

you could show the picture to TNetters by mailing  it to Steve Gregory  [log in to unmask] whom very kindly support us when we need to attach picture (many thank Steve for you service) so all the TNetters will see the picture.

I have seen your picture, yes it is a IPS (Inner Plane Separation) from PTH.
It may be due to thermal stress in Z assy, but why ?
You made baking to PCB so it should not be a matter of internal over pressure due to moisture blow-off.

Or may be too low Tg of laminate or high CTE in Z assy ?
Are you running Lead Free Reflow ?

Etc...
Gabriele


-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]] Per conto di Zilber Gil
Inviato: giovedì 19 aprile 2018 10:27
A: [log in to unmask]
Oggetto: Re: [TN] R: [TN] PCB failure

Thanks Gariele,
The PCB is new, and it was baked before assembly.
Thanks,
Gil



נשלח מסמארטפון ה-Samsung Galaxy שלי.


-------- הודעה מקורית --------
מאת: SALA GABRIELE <[log in to unmask]>
תאריך: 19.4.2018 10:07 (GMT+01:00)
אל: [log in to unmask]
נושא: [TN] R: [TN] PCB failure

Hi Gil,

did you handled correctly PCB against moisture absorption ? Like guide lines of IPC-1601A ?
Shelf life of your PCB ?
Any Baking before reflow?

Gabriele

PS: no picture is attached

-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]] Per conto di Gil ZIlber
Inviato: giovedì 19 aprile 2018 09:27
A: [log in to unmask]
Oggetto: [TN] PCB failure

Hello Tech,
We encounter a PCB discontinuing. Cross section shows conductor separation from TH.
The PCB manufacturer claims it is due to overheating during assembly. To me, it looks like bad PCB manufacturing.
Please look at the picture and give me your feedback.
Thank you


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The information contained in this communication is proprietary to Israel Aerospace Industries Ltd. and/or third parties, may contain confidential or privileged information, and is intended only for the use of the intended addressee thereof. If you are not the intended addressee, please be aware that any use, disclosure, distribution and/or copying of this communication is strictly prohibited. If you receive this communication in error, please notify the sender immediately and delete it from your computer.

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