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April 2018

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Subject:
From:
Tan Geok Ang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
Date:
Tue, 17 Apr 2018 08:49:56 +0000
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Yes, for the evlaution, I did placed both chip and QFP into the vacuum oven with 40degreeC and about 9 millibar. Did not encountered any problem to solder the components. The tape and reel were still in good conditions.

________________________________________
From: Stadem, Richard D [[log in to unmask]]
Sent: Monday, 16 April, 2018 7:55:11 PM
To: TechNet E-Mail Forum; Tan Geok Ang
Subject: RE: [TN] Vacuum Baking

Did you do that for components in tape and reel packaging, or out of it?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tan Geok Ang
Sent: Saturday, April 14, 2018 12:47 AM
To: [log in to unmask]
Subject: Re: [TN] Vacuum Baking

I did evaluated the process of vacuum, it does help.

________________________________

From: Robert Kondner <[log in to unmask]>
Date: 14 April 2018 at 10:13:03 AM SGT
To: 'TechNet E-Mail Forum' <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
Subject: RE: [TN] Vacuum Baking

As A Note I recall a discussion long ago that vacuum does not speed up water diffusion.

Does anyone recall? The rate of diffusion was more dependent on the concentration difference and temperature.

Bob K.
-----Original Message-----
From: TechNet <[log in to unmask]> On Behalf Of Tan Geok Ang
Sent: Friday, April 13, 2018 9:23 PM
To: [log in to unmask]
Subject: Re: [TN] Vacuum Baking

Thanks. I am able to find it. Thanks

________________________________

From: Tan Geok Ang <[log in to unmask]>
Date: 14 April 2018 at 9:20:59 AM SGT
To: TechNet E-Mail Forum <[log in to unmask]>, Wayne Showers <[log in to unmask]>
Subject: Re: [TN] Vacuum Baking

Hi Wayne,
Are you able to send me a copy? Thx

________________________________

From: Wayne Showers <[log in to unmask]>
Date: 14 April 2018 at 6:38:35 AM SGT
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] Vacuum Baking

You might want to check out this paper:
Characteristic Times of Moisture Diffusion and Bake-out Conditions for Plastic Encapsulated Parts written by Alexander Teverovsky QSS Group, Inc./Goddard Operations [log in to unmask]

I have emailed you a copy.  Of note is that the key temperature for any bake out under vacuum is 58C.

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