Lots of solutions come to mind, but too many questions also. Is the raised portion rectangular, or irregularly shaped? How far away are the components from the raised portion around the perimeter? Why is the board thicker around the edges?  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vargas, Stephen M
Sent: Monday, April 16, 2018 10:41 AM
To: [log in to unmask]
Subject: [TN] Step PCB

Good Morning:

      We have an application here where I need to assemble/solder a large volume of SMT parts on a PCB that is .125" thick and has a raised step (.020") around much of the perimeter of the PCB. I will be doing a volume large enough that hand soldering is not an option. My initial thought were to use an inverted step stencil, but with an .020" step, I'm thinking I'd never be able to overcome the aspect ratios. The other two options I was considering were paste jet dispensing (although I would prefer to avoid the capital cost) and SiPAd. Just wondering if anyone out there has experienced an application like this and what might be our most effective option. Thanks in advance for  your input.

Regards,
Steve Vargas