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April 2018

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Subject:
From:
"Vargas, Stephen M" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Vargas, Stephen M
Date:
Mon, 16 Apr 2018 15:41:16 +0000
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Good Morning:

      We have an application here where I need to assemble/solder a large volume of SMT parts on a PCB that is .125" thick and has a raised step (.020") around much of the perimeter of the PCB. I will be doing a volume large enough that hand soldering is not an option. My initial thought were to use an inverted step stencil, but with an .020" step, I'm thinking I'd never be able to overcome the aspect ratios. The other two options I was considering were paste jet dispensing (although I would prefer to avoid the capital cost) and SiPAd. Just wondering if anyone out there has experienced an application like this and what might be our most effective option. Thanks in advance for  your input.

Regards,
Steve Vargas

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