agree.  you can also use RP system (I believe it is A type that  
absorb moisture in addition to the corrosive gas... the other type is  
used not for electronics, but biological stuff- keep the moisture in  
the bag... so be careful what you use).
http://ageless.mgc-a.com/applications/product/rp-system/
if you do use RP, make sure you have moisture barrier bag and good  
vacuum (not thin ESD bag).  No heat needed... excellent for high  
price heat sensitive device.  IMHO.  (pricy for a good reason).
http://ageless.mgc-a.com/applications/product/rp-system/
jk
On Apr 14, 2018, at 1:47 AM, Tan Geok Ang wrote:

> I did evaluated the process of vacuum, it does help.
>
> ________________________________
>
> From: Robert Kondner <[log in to unmask]>
> Date: 14 April 2018 at 10:13:03 AM SGT
> To: 'TechNet E-Mail Forum' <[log in to unmask]>, Tan Geok Ang  
> <[log in to unmask]>
> Subject: RE: [TN] Vacuum Baking
>
> As A Note I recall a discussion long ago that vacuum does not speed  
> up water
> diffusion.
>
> Does anyone recall? The rate of diffusion was more dependent on the
> concentration difference and temperature.
>
> Bob K.
> -----Original Message-----
> From: TechNet <[log in to unmask]> On Behalf Of Tan Geok Ang
> Sent: Friday, April 13, 2018 9:23 PM
> To: [log in to unmask]
> Subject: Re: [TN] Vacuum Baking
>
> Thanks. I am able to find it. Thanks
>
> ________________________________
>
> From: Tan Geok Ang <[log in to unmask]>
> Date: 14 April 2018 at 9:20:59 AM SGT
> To: TechNet E-Mail Forum <[log in to unmask]>, Wayne Showers
> <[log in to unmask]>
> Subject: Re: [TN] Vacuum Baking
>
> Hi Wayne,
> Are you able to send me a copy? Thx
>
> ________________________________
>
> From: Wayne Showers <[log in to unmask]>
> Date: 14 April 2018 at 6:38:35 AM SGT
> To: [log in to unmask] <[log in to unmask]>
> Subject: Re: [TN] Vacuum Baking
>
> You might want to check out this paper:
> Characteristic Times of Moisture Diffusion and Bake-out Conditions for
> Plastic Encapsulated Parts written by Alexander Teverovsky QSS Group,
> Inc./Goddard Operations [log in to unmask]
>
> I have emailed you a copy.  Of note is that the key temperature for  
> any bake
> out under vacuum is 58C.