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Subject:	Re: flex fabrication
From:	Steven Kelly <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Steven Kelly <[log in to unmask]>
Date:	Thu, 12 Apr 2018 17:56:43 +0000
Content-Type:	text/plain
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Hi Jack,

If this was for a ZIF connector then you should have dimensioned the flex per the ZIF suppliers recommendation. If it was for some other application you should have still dimensioned it if it was important to the design . There are no defaults in the flex specifications. Regards  Steve Kelly



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson

Sent: April-12-18 1:20 PM

To: [log in to unmask]

Subject: [TN] flex fabrication



I'm designing a flexible circuit that is little more than a glorified ribbon cable, but nothing "off-the-shelf" will work. (So it is just a single layer of conductors on polyimide with a coverlayer, but no tooling holes or any other features).



Our first prototypes came back with the conductors off-center from the board outline. I can't find anything in IPC-6013 that addresses the relationship of the circuit pattern to the board outline, but it definitely has to be tighter than a typical rigid board.



Is the "pattern-to-board-outline" relationship covered anywhere else?

Do I have to add some kind of note or dimension to keep the pattern "centered" in the outline?

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