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April 2018

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Subject:
From:
"Stadem, Richard D" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D
Date:
Tue, 10 Apr 2018 11:27:31 +0000
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Good old Kester!

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Yuan-chia Joyce Koo
Sent: Monday, April 09, 2018 6:33 PM
To: [log in to unmask]
Subject: Re: [TN] A Fungus Nutrient Question

it is in the formulation.  your vendor should tell you.  e.g. "6 Feb
2015 ... Kester 186-18, under MIL-F-14256, was QPL approved as Type RMA. ... Type RMA flux. This flux possess high thermal stability for soldering multi-layer assemblies which require a high preheat temperature. Exposure to high preheat temperatures ... The flux residue is also moisture and fungus resistant."


On Apr 9, 2018, at 6:03 PM, David Hillman wrote:

> Hi team! Looking for TechNet's sage wisdom. Some folks are familiar 
> with this but many electronic modules have a "shall not be a fungus 
> nutrient material"  in terms of the components materials, laminate 
> materials, etc. I was asked the question if "properly reflowed flux 
> materials are classified as non-fungus nutrient supporting". Does 
> anyone have an knowledge/ data on properly reflowed flux residue being 
> "non fungus nutrient supporting"?
>
> TIA
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]

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