TECHNET Archives

April 2018

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
FW: IPC Guideline for Gull Wing lead PWB pad to component lead ratio
From:
[log in to unmask]
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 6 Apr 2018 14:22:59 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines) 
Fellow TechNetters:

   I don't have a part number nor spec, I only have the sample PCIe LF connector, 164 gull wing pins soldered  onto a test board.   I there a simple Rule Of Thumb for selecting a suitable PWB pad side which will yield an acceptable toe, heel and side negative solder wetting angle?

Victor,

From: Hernandez, Victor G
Sent: Tuesday, April 3, 2018 10:00 AM
To: TechNet E-Mail Forum <[log in to unmask]>
Cc: Hernandez, Victor G <[log in to unmask]>
Subject: IPC Guideline for Gull Wing lead PWB pad to component lead ratio

Fellow TechNetters:

   Can someone point me in the right direction for PWB SMT pad dimensions for gull wing devices?   Heel LF solder fillet formation concern.

Victor,

ATOM RSS1 RSS2