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April 2018

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Subject:
Re: Flux question
From:
BEV CHRISTIAN <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, BEV CHRISTIAN <[log in to unmask]>
Date:
Thu, 26 Apr 2018 20:15:36 -0400
Content-Type:
text/plain
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text/plain (41 lines) 
😊  I see you use “eh”.  Part Canuck?
Bev

Sent from Mail for Windows 10

From: Stadem, Richard D
Sent: Thursday, April 26, 2018 1:19 PM
To: [log in to unmask]
Subject: Re: [TN] Flux question

Bev, you anwered at 12:17 my time, and I sent at 12:18 my time.
Then I read your response below.
Great minds think alike, eh?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of BEV CHRISTIAN
Sent: Thursday, April 26, 2018 12:17 PM
To: [log in to unmask]
Subject: Re: [TN] Flux question

Joey,
You probably don’t want to hear this, but
 the answer is “it depends”.  How marginal is marginal? What is the lead finish? Are the pad connected to a ground plane?  What is your reflow profile?

Regards,
Bev

Sent from Mail for Windows 10

From: Jose A Rios
Sent: Thursday, April 26, 2018 1:06 PM
To: [log in to unmask]
Subject: [TN] Flux question

Is ROL0 flux an adequate one when faced with having to solder marginally oxidized components. Or should a different flux type be selected. Application is ground based/hi-rel (non flight). Flowdown is J-001 (not space addendum). Thanks
.


José (Joey) Ríos, Sr QA Engineer
Mission Assurance Manager
Kavli Institute for Astrophysics & Space Research Massachusetts Institute of Technology [log in to unmask]<mailto:[log in to unmask]>
(617)324-6272

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