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From:
Jose A Rios <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jose A Rios <[log in to unmask]>
Date:
Thu, 26 Apr 2018 17:39:52 +0000
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QFN’s in a Lead-free environment (like SAC305). 



> On Apr 26, 2018, at 1:19 PM, Stadem, Richard D <[log in to unmask]> wrote:

> 

> Bev, you anwered at 12:17 my time, and I sent at 12:18 my time.

> Then I read your response below.

> Great minds think alike, eh?

> 

> -----Original Message-----

> From: TechNet [mailto:[log in to unmask]] On Behalf Of BEV CHRISTIAN

> Sent: Thursday, April 26, 2018 12:17 PM

> To: [log in to unmask]

> Subject: Re: [TN] Flux question

> 

> Joey,

> You probably don’t want to hear this, but… the answer is “it depends”.  How marginal is marginal? What is the lead finish? Are the pad connected to a ground plane?  What is your reflow profile?

> 

> Regards,

> Bev

> 

> Sent from Mail for Windows 10

> 

> From: Jose A Rios

> Sent: Thursday, April 26, 2018 1:06 PM

> To: [log in to unmask]

> Subject: [TN] Flux question

> 

> Is ROL0 flux an adequate one when faced with having to solder marginally oxidized components. Or should a different flux type be selected. Application is ground based/hi-rel (non flight). Flowdown is J-001 (not space addendum). Thanks….

> 

> 

> José (Joey) Ríos, Sr QA Engineer

> Mission Assurance Manager

> Kavli Institute for Astrophysics & Space Research Massachusetts Institute of Technology [log in to unmask]<mailto:[log in to unmask]>

> (617)324-6272




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