TECHNET Archives

April 2018

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Flux question
From:
BEV CHRISTIAN <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, BEV CHRISTIAN <[log in to unmask]>
Date:
Thu, 26 Apr 2018 13:17:10 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines) 
Joey,
You probably don’t want to hear this, but… the answer is “it depends”.  How marginal is marginal? What is the lead finish? Are the pad connected to a ground plane?  What is your reflow profile?

Regards,
Bev

Sent from Mail for Windows 10

From: Jose A Rios
Sent: Thursday, April 26, 2018 1:06 PM
To: [log in to unmask]
Subject: [TN] Flux question

Is ROL0 flux an adequate one when faced with having to solder marginally oxidized components. Or should a different flux type be selected. Application is ground based/hi-rel (non flight). Flowdown is J-001 (not space addendum). Thanks….


José (Joey) Ríos, Sr QA Engineer
Mission Assurance Manager
Kavli Institute for Astrophysics & Space Research
Massachusetts Institute of Technology
[log in to unmask]<mailto:[log in to unmask]>
(617)324-6272

ATOM RSS1 RSS2