Good morning,

Is there a recent peer reviewed study or presentation (reported in open
literature) that discusses the relative reliability of various etchback
conditions in context of applied stresses, processing conditions and
materials (high Tg 180C++ laminates, higher 10%++ elongation foil and
higher 15%++ elongation plating chemistries)? (I am not looking for
sections/paragraphs of applicable Standards)

In some instances, the merits of positive etchback are discussed in context
of a "three point connection", but one disadvantage of this arrangement is
poor low cycle fatigue reliability.
Literature has reported that negative etchback "up to a certain extent" is
reliable, however one disadvantage is a possibly poor foil to barrel
connection in cases where process residues prevent a good connection with
the foil. The no etchback (only smear removed) is also shown in literature
as reliable, and the middle of the road solution to the etchback
requirement.

Thanks,
Bhanu

-- 
Bhanu Sood