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Subject:
Re: FW: IPC-A-610G, section 5.2.9,, Solder anomalies-Fractured solder, Defect 1, 2, 3 (Axial leaded device)
From:
Tan Geok Ang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
Date:
Fri, 6 Apr 2018 11:59:59 +0000
Content-Type:
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Any Fractured Solder is Not acceptable.

________________________________

From: [log in to unmask] <[log in to unmask]>
Date: 6 April 2018 at 6:54:05 PM SGT
To: [log in to unmask] <[log in to unmask]>
Subject: [TN] FW: IPC-A-610G, section 5.2.9,, Solder anomalies-Fractured solder, Defect 1, 2, 3 (Axial leaded device)

Fellow TechNetters:

   I was surprised that very little input was provided.   Therefore, since it Friday Elements QUIZ day. I will take advantage of the high volume traffic day.

Victor,

From: Hernandez, Victor G
Sent: Thursday, April 5, 2018 10:22 AM
To: TechNet E-Mail Forum <[log in to unmask]>
Cc: Hernandez, Victor G <[log in to unmask]>
Subject: IPC-A-610G, section 5.2.9,, Solder anomalies-Fractured solder, Defect 1, 2, 3 (Axial leaded device)

Fellow TechNetters:

   Is there a percentage associated with the statement "Fractured Solder" in the above stated IPC STD section?
I did not a similar statement, Fractured Solder, for Surface Mount Devices and Surface Mount Area.
Is there an acceptable percentage of the solder joint lead interface that can be fractured?


Victor,

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