Hi Gil - if you have the resources, you should put that cross section in
the SEM and look for possible resin smear on the inner layer/PTH interface.
Resin smear could cause the defect you are seeing.
Dave Hillman
Rockwell Collins
[log in to unmask]
On Thu, Apr 19, 2018 at 4:02 AM, Zilber Gil <[log in to unmask]> wrote:
> Thanks
> It is a leaded hand soldering of that device. I will check if the other
> failed location has hand soldering also. The material is a high tg material
> (Isola 370 HR).
> Regards,
> Gil
>
>
>
> נשלח מסמארטפון ה-Samsung Galaxy שלי.
>
>
> -------- הודעה מקורית --------
> מאת: SALA GABRIELE <[log in to unmask]>
> תאריך: 19.4.2018 10:46 (GMT+01:00)
> אל: 'TechNet E-Mail Forum' <[log in to unmask]>, Zilber Gil <
> [log in to unmask]>
> נושא: R: [TN] R: [TN] PCB failure
>
> Gil,
>
> you could show the picture to TNetters by mailing it to Steve Gregory
> [log in to unmask] whom very kindly support us when we need to attach
> picture (many thank Steve for you service) so all the TNetters will see the
> picture.
>
> I have seen your picture, yes it is a IPS (Inner Plane Separation) from
> PTH.
> It may be due to thermal stress in Z assy, but why ?
> You made baking to PCB so it should not be a matter of internal over
> pressure due to moisture blow-off.
>
> Or may be too low Tg of laminate or high CTE in Z assy ?
> Are you running Lead Free Reflow ?
>
> Etc...
> Gabriele
>
>
> -----Messaggio originale-----
> Da: TechNet [mailto:[log in to unmask]] Per conto di Zilber Gil
> Inviato: giovedì 19 aprile 2018 10:27
> A: [log in to unmask]
> Oggetto: Re: [TN] R: [TN] PCB failure
>
> Thanks Gariele,
> The PCB is new, and it was baked before assembly.
> Thanks,
> Gil
>
>
>
> נשלח מסמארטפון ה-Samsung Galaxy שלי.
>
>
> -------- הודעה מקורית --------
> מאת: SALA GABRIELE <[log in to unmask]>
> תאריך: 19.4.2018 10:07 (GMT+01:00)
> אל: [log in to unmask]
> נושא: [TN] R: [TN] PCB failure
>
> Hi Gil,
>
> did you handled correctly PCB against moisture absorption ? Like guide
> lines of IPC-1601A ?
> Shelf life of your PCB ?
> Any Baking before reflow?
>
> Gabriele
>
> PS: no picture is attached
>
> -----Messaggio originale-----
> Da: TechNet [mailto:[log in to unmask]] Per conto di Gil ZIlber
> Inviato: giovedì 19 aprile 2018 09:27
> A: [log in to unmask]
> Oggetto: [TN] PCB failure
>
> Hello Tech,
> We encounter a PCB discontinuing. Cross section shows conductor separation
> from TH.
> The PCB manufacturer claims it is due to overheating during assembly. To
> me, it looks like bad PCB manufacturing.
> Please look at the picture and give me your feedback.
> Thank you
>
>
> ---
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> The information contained in this communication is proprietary to Israel
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> addressee thereof. If you are not the intended addressee, please be aware
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