Steve,
I would be careful with this as Doug has stated. Also the materials used in reels and cover tape simply won't take anywhere near the temperature needed to effectively bake the component without suffering distortion and other issues, let alone the potential to outgas/offgas.
How do I know? Parts in reels were baked and the reels and tape were so affected the whole lot was scrapped. The cost to get them into new reels and cover tape almost equaled buying new parts. The biggest negative was the time lost off the scheduled delivery. Parts were delivered in packaging not correct for their MSL. The folks on the front end sent them to be baked dry, first time event for reeled parts. No protocol for reeled parts so the protocol for trayed parts was followed. No one to blame really. Long talks with component people about reels and cover tape. New protocol established. Incredibly long bake at low temperature.
The information on what temperature the cover tape and reel can accommodate is most often not available in any standard parts data sheet.
Drew
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas Pauls
Sent: Monday, April 16, 2018 1:26 PM
To: [log in to unmask]
Subject: Re: [TN] Vacuum Baking
Steve,
I would not be an advocate of this approach. If you get the tape and reel hot enough to make moisture diffuse out, you may also be causing the plastic to outgas/offgass materials that would be detrimental to the component.
Doug Pauls
Principal Materials and Process Engineer Rockwell Collins
On Mon, Apr 16, 2018 at 9:19 AM, Steve Gregory <[log in to unmask]> wrote:
> Hi All,
>
> I know this thread is about vacuum baking, but I would like to ask
> about baking components on tape and reel, I have not actually done
> this. I remember seeing discussion about the topic on Technet, but I
> can't remember all the details.
> I know when I ask what temperature is safe to bake tape and reel
> components "it depends" will come up, it probably depends on what kind
> of carrier tape on top film cover tape is used, is it pressure
> sensitive adhesive or heat seal cover tape? I'm seeing a need that may
> require more baking of reeled components now for some reason.
>
> Is it just me, or does it seem that more and more components are being
> designated as MSL 2A and higher lately?
>
> Steve
>
> On Mon, Apr 16, 2018 at 8:09 AM, Yuan-chia Joyce Koo
> <[log in to unmask]>
> wrote:
>
> > you can make board vertical stand in the PWA carrier tray with slot.
> > you need surface area for moisture to escape...assume you use low
> > temperature in vacuum baking, little warpage would happen unless it
> > is very thin
> large
> > size board.
> > On Apr 16, 2018, at 9:23 AM, Robert Kondner wrote:
> >
> > Hi,
> >>
> >> If you have a stack of PCBs, lets say 25 or 50 boards which is a
> >> stack
> 2
> >> or 3 inches high, can water vapor diffuse out the space between the
> boards?
> >> Does laying a thick tissue between the boards help or is it best to
> place
> >> each board in edge supported carriers? I worry about warp if a
> >> board is edge supported while at elevated temps.
> >>
> >> Does anyone has knowledge here or even an educated guess?
> >>
> >> Thanks,
> >> Bob K.
> >>
> >> -----Original Message-----
> >> From: TechNet <[log in to unmask]> On Behalf Of David Hillman
> >> Sent: Monday, April 16, 2018 8:11 AM
> >> To: [log in to unmask]
> >> Subject: Re: [TN] Vacuum Baking
> >>
> >> Hi folks - we did some vacuum baking experimentation a few years
> >> back
> and
> >> yes, vacuum baking can be effective but it is not as straight
> >> forward as you would imagine. You need to carefully select the
> >> vacuum bake
> parameters
> >> or you will actually impede water diffusion. You can cause ice
> >> formation rather than water evaporation depending on your
> >> parameters (put a
> shallow
> >> pan of water in a vacuum chamber and try it, its kinda fun).
> >> Wayne's approach is much simpler and far more practical/effective
> >> in terms of moisture removal.
> >>
> >> Dave Hillman
> >> Rockwell Collins
> >> [log in to unmask]
> >>
> >>
> >> On Sun, Apr 15, 2018 at 11:43 AM, Wayne Showers <
> >> [log in to unmask]> wrote:
> >>
> >> The problem with vacuum drying is not so much the boiling point of
> >>> water as in an unimpeded environment, those values are: At 25" Hg :
> 56C,
> >>> 27" Hg :
> >>> 45C, 28" Hg :40C, and so on. The problem is degree of impediment
> >>> caused by the actual plastic. To build off what Yuan-chia Joyce
> >>> Koo has stated but with a different vector in mind, the plastic
> >>> material of moisture bags for instance is highly resistant to diffusion.
> >>> Different polymers will follow accordingly.
> >>>
> >>> For information, many plastics must be dried immediately prior to
> >>> molding otherwise they suck up moisture like a sponge. Common
> >>> hygroscopic polymers are Nylon, ABS (Acetyl Butyl Styrene), PC
> >>> (Polycarbonate), and PMMA (Poly (methyl methacrylate)). Nylon and
> >>> PMMA are very common materials in component shells. ABS and PC
> >>> index* at temperatures not much higher than boiling water and are
> >>> not typically used. PP (Polypropylene) and PE
> >>> (Polyethylene) are not so bad, hence their use in capacitors, but
> >>> these index in the 200C range making them a bear for SMT placement.
> >>> My general rule is the higher the MSL number, i.e., the more
> >>> likely a part is to absorb moisture, the easier it is to dry.
> >>>
> >>> For normal bake (NO vacuum), here is the formula I derived several
> >>> years
> >>> ago:
> >>> Thickness (mm) X Thickness (mm) (Divided by) Bake Temp Factor
> >>> D125oC=
> >>> 0.4427 // D90oC= 0.1270 // D40oC= 0.0131, Result is time in hours.
> >>>
> >>> I have never experimented with Vacuum Acceleration, but I will
> >>> query the Penn State Plastics Engineering group with what we are
> >>> trying to resolve and post those results to the J-STD-033
> >>> committee as well as here.
> >>> * Index is the temperature at which a plastic flows well enough to
> >>> be molded. It is neither solid nor liquid, but soliquid.
> >>>
> >>> This all sounds like a job for Clumpy and Kloumpios when they are
> >>> next available.
> >>>
> >>>
>
>
> --
> Steve Gregory
> Kimco Design and Manufacturing
> Process Engineer
> (208) 322-0500 Ext. -3133
>
> --
>
>
>
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