Hi Dave,

Don't know if you have already checked with Berquist Inc. (they deal almost
exclusively with thermal management), but I bet they could help with
selection of a good material or method to heatsink a component.

Steve

On Wed, Mar 14, 2018 at 10:49 AM, Dave Schaefer <[log in to unmask]>
wrote:

> Does anyone have any references to good information regarding the amount
> of compression that can be applied to an SAC BGA component for heat sinking
> purposes? We want to maximize our thermal performance without sacrificing
> solder joint & component reliability.
>



-- 
Steve Gregory
Kimco Design and Manufacturing
Process Engineer
(208) 322-0500 Ext. -3133

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