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March 2018

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Subject:
BGA Heatsink Compression
From:
Dave Schaefer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dave Schaefer <[log in to unmask]>
Date:
Wed, 14 Mar 2018 11:49:00 -0500
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Does anyone have any references to good information regarding the amount of compression that can be applied to an SAC BGA component for heat sinking purposes? We want to maximize our thermal performance without sacrificing solder joint & component reliability.

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