Dear All, We have a 5x5mm  LGA package that failed  solderability test for "Dip and Look" as well as "Surface Mount Reflow Simulation test". The LGA package has a flip chip die on a thin PCB substrate. The termination plating is NiPdAu.  Black Pad issue appears to be suspect, but we have not verified  this . Our FA Lab does not have the ability to etch Pd/Au  to expose theNickel.is there another wary to verify the Nickel surface for black pad formation.  I will request Steve Gregory to attach some images on his website. We are seeing dents(probe marks)  and grainy structure on the plating. The X-section shows a separation between mounting epoxy and  plated surface.  Any insight will be appreciated.

Dip and Look test

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Surface Mount simulation Test

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Thank-you,
Mumtaz
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