Victor,
not sure what others do, but in good old days, for new material/ 
process that required for new platform of technology (low CTE  
laminate, ultra high density, etc.etc.), I would look at the existing  
qual matrix (assume you have that in house), with additional  
requirements that either draw from test method, or just dream out of  
own to cover the new requirements, that including electrical testing  
if the density is high (high temp, damp condition, what ever)... of  
cause, with vendor's input (work together)... usually the vendor will  
love to be involved in such project, knowing they are in the  
potential leading edge that may benefit future products... you  
basically 2-3 years ahead of next gen std... you can submit the data  
when you sort the things out or keep it in house with vendor NDA  
(better, treat as trade secrete if no benefit to get a second  
vendor)... if you have new technology, normally the current existing  
std will not be sufficient... you pick and choose to make sure it  
covers all your needs.  (you keep eyes on ITRS- used to be, roadmap  
for semi, and make sure you cover the interconnect that can match the  
required I/O, voltage, to walk off the chip with bottleneck not in  
the PWB/module for the design... split multi-voltage ground for  
example if you have digital analog mixed design... large ground may  
impact your laminate adhesion, warpage, etc.etc.. surface ground  
might be better if also used as heatsink... it might be better to  
have two PWA if speed is not a concern, etc.etc. you talk about it  
with the design and see what they would like to do... real teamwork)  
IMHO.  this was this dinosaur would do... (you might be able to get  
away with many of those stuff with computer simulation nowadays...  
but this dinosaur didn't believe virtue world very much - especially,  
knowing you can set boundary condition for FEM as you wish.., just  
like not into the crypto currency... ).
good luck.
jk
On Mar 8, 2018, at 8:49 AM, <[log in to unmask]>  
<[log in to unmask]> wrote:

> Fellow TechNetters:
>
>    I did not receive responses to my initial inquiry.   Therefore,  
> I post once again.   IMHO, Industry Standards are so convoluted  
> that it takes a dinosaurs to interpret the documents much less draw  
> correlation between the documents.
>
> Victor,
>
> From: Hernandez, Victor G
> Sent: Monday, March 5, 2018 12:37 PM
> To: 'TechNet E-Mail Forum' <[log in to unmask]>
> Cc: Hernandez, Victor G <[log in to unmask]>
> Subject: TM-650-2.1.1; 2.1.1.2 & 2.6.8
>
> Fellow TechNetters:
>
>    What is the purpose of IPC-A-600 (J) if this standard document   
> is not stated/mentioned/referenced in the above TMs.
>                 2.1.1      section 5.4.3   Quality Observations,  
> etc..............
>                 2.1.1.2  section 5.2.3   Evaluation, etc..........
>                 2.6.8      section 5.7.2   Examine for compliance,  
> etc.......
>
> Is there a separate document for NEW Laminate Qualification.
>
> Victor,