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March 2018

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Subject:
From:
Matthias Mansfeld <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Matthias Mansfeld <[log in to unmask]>
Date:
Wed, 7 Mar 2018 12:02:41 +0100
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On 7 Mar 2018 at 4:14, Yow GawChern wrote:

> Hi,
> 
> I would like to ask, for current technology, is surface mount chip
> size 0402 (1005) suitable for solder wave process?

I would guess, it depends. If you have the glue process perfectly 
under control and the placement is OK, why not? Maybe you will need 
to try it first with a dummy board and to optimize the layout and the 
settings of your wave inluding scrapping 100 prototype boards. 
Philips (good old times, when research - Klein-Wassink! -, 
P&P/soldering equipment, passive components and active components 
were together) they had wave soldering recommendations for 0.5mm 
pitch QFPs and I know many designs (mostly high volume consumer 
stuff) where it worked fine.

Maybe you find at Vishay (last not least former Philips Components 
passsives business) recommendations which look reliable. 

Regards
Matthias
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