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March 2018

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Subject:
Re: BGA and other array package rework
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Sat, 31 Mar 2018 15:39:53 +0000
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text/plain
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		Actually using a laser rework station for this.
It keeps all surrounding components below melting point even on a double sided mirror imaged BGA design.
Best regards,
John
		

		Sent from my iPad Pro
	





On Fri, Mar 30, 2018 at 1:19 PM -0700, "Guy Ramsey" <[log in to unmask]> wrote:










We are seeing more and more designs where it is not possible, with our BGA
reworkstation, to remove or reinstall components and not reflow adjacent
parts, or in some cases, part on the opposite side of the assembly.
What action do you all take to mitigate the resulting conditions?

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