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March 2018

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TechNet <[log in to unmask]>
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TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>, "[log in to unmask]" <[log in to unmask]>
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Sat, 3 Mar 2018 00:42:14 +0000
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TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
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Subject:
LCC package pads/terminals qualification test
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Tan Geok Ang <[log in to unmask]>
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What the standards are applicable to ensure and qualify the pads strength requirement for this package. Thanks

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