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Mon, 12 Mar 2018 16:25:35 +0000 |
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Dear All, We have a 5x5mm LGA package that failed solderability test for "Dip and Look" as well as "Surface Mount Reflow Simulation test". The LGA package has a flip chip die on a thin PCB substrate. The termination plating is NiPdAu. Black Pad issue appears to be suspect, but we have not verified this . Our FA Lab does not have the ability to etch Pd/Au to expose theNickel.is there another wary to verify the Nickel surface for black pad formation. I will request Steve Gregory to attach some images on his website. We are seeing dents(probe marks) and grainy structure on the plating. The X-section shows a separation between mounting epoxy and plated surface. Any insight will be appreciated.
Dip and Look test
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Surface Mount simulation Test
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Thank-you,
Mumtaz
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