IPC 6012D has 1x solder float (method 2.6.8) as the default method; the above (2.6.27) is also supported by 6012, but it has to be specified by the user in procurement documentation (whether its the drawing or a PO clause elsewhere). If its not specifically called out, 2.6.8 prevails as the thermal stress method used during acceptance. Fabs may have a mix of product requirements in builds at the same time that would result in some testing to 2.6.27 for specific builds but no fab would do a 2.6.27 without it being imposed specifically.
José (Joey) Ríos, Sr QA Engineer
Mission Assurance Manager
Kavli Institute for Astrophysics & Space Research
Massachusetts Institute of Technology
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(617)324-6272
On Feb 2, 2018, at 7:28 AM, Dwight Mattix <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Fwiw, we put our thermal stress/lot acceptance stuff like this in a PWB supplier Quality Rqmts Document (minimize clutter on fab drawings). PO, drawing or stand alone document -- all work. Just a matter of style preferred.
We also have a section in that document outlining our basic qualification/reliability demonstration requirements (with some weasel words/disclaimers about it being a TBD on a case by case basis. Depends on specific end use case & class of product a qual effort is being used for).
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Craig Sullivan
Sent: Friday, February 2, 2018 5:50 AM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: [TN] Thermal Stressing PCB per TM-650 2.6.27
Hi All,
I am wondering about thermal stress testing per IPC-TM-650 2.6.27 (260° reflow profile 6x) as one of the requirements in IPC-6012
For Assemblers:
Do you require this of all fab houses you buy from?
Do you request your customer add it to the FAB drawing?
For Fab Houses:
Do you automatically do this as part of your QC plan ?
How often? Per lot? Per Date Code? Etc.
Do you only do it when requested?
Do you require it to be on the fab drawing or could a CM flow it down through the PO even though the fab drawing is from the end customer?
Material depending, would you run 260° even if it was not a lead-free PCB?
Any other comments welcomed.
Craig Sullivan
Manufacturing Engineer
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