the conductive adhesive joint quality is a different animal as  
compare to solder joints - you can't really rely on visual (amount is  
the only thing you can tell).  the quality of the joints could be  
different as your insertion force (tap down instead of drop down -  
tap - light force to insert - will let Ag flake lying flat and make  
more conductive joints)... the selection of material is also a key...  
some has adhesion promoter (polymeric based), that will form a  
polymer rich interface layer if sitting too long before cure... and  
degree of cure is also critical.
As for LED, poorly formed joints exhibit higher resistance joint,  
that in long term, can be harmful to the LED light output (heat sink  
issue).  Being said that, modulation - electrical design got a lot   
to do with it... LED like to be pulsed, rather  than  CC.  the joints  
better be qualified per user application and duration of life time  
(using accelerated test and optical output as quality)  rather than  
visual as like A610.  My 1.5 cents.
jk
On Feb 26, 2018, at 8:51 AM, Tempea, Ioan wrote:

> Hi Bob,
>
> You might also want to look at MIL-STD-883K, method 2010, para.  
> 3.2.3.2 and see what is applicable.
>
> Best regards,
>
> Ioan
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Wettermann
> Sent: February 23, 2018 4:10 PM
> To: [log in to unmask]
> Subject: [TN] Conductive Epoxy Inspection Criteria on Flex for LED
>
> We have a project where we are inspecting an SMT LED (roughly 0603
> size-English) mounted w/conductive epoxy on a flex circuit.
>
> What inspection criteria would we reference? Go by the A610 and  
> adopt it?
>
> Have a good weekend.........
> -- 
> Bob Wettermann
> BEST Inc
> [log in to unmask]
>