There is a spec JEDEC MO-269 that calls out requirements for DDR3 DIMMs.
Some of the datasheets from connector manufacturers give guidance for the mating boards. If you don't know the mfr part number for the actual connector you could try Molex 78316-0001. It is EOL, but maybe you can find a datasheet or one for the replacement part.
Both documents show chamfer dimensions and label them optional.
Best regards,
Raye Rivera
Raye Rivera | Quality Manager | Spirent Communications, Inc.
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From: TechNet [mailto:[log in to unmask]] On Behalf Of TechNet automatic digest system
Sent: Thursday, February 22, 2018 10:00 PM
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Date: Thu, 22 Feb 2018 15:38:21 +0000
From: [log in to unmask]
Subject: DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer
Dell - Internal Use - Confidential
Fellow TechNetters:
Is there an consensus out there whether the gold finger edge on DDR3 DIMM Modules be beveled/Coined/Chamfer. I would appreciate any comments/remarks on this topic.
Victor,
-----Original Message-----
From: Hernandez, Victor G
Sent: Wednesday, February 21, 2018 1:10 PM
To: TechNet <[log in to unmask]>
Cc: Hernandez, Victor G <[log in to unmask]>
Subject: FW: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer
Fellow TechNetters:
Any additional comments and/or concern over the gold finger edge being Beveled/Coined/Chamfered. Many a times do I see socket with gold plated wire contact gouges from DIMM product that has not been beveled/Coined/Chamfered, even bent pins.
Victor,
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