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February 2018

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From:
Gerry Gagnon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gerry Gagnon <[log in to unmask]>
Date:
Thu, 22 Feb 2018 19:16:58 +0000
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I mentioned that earlier and it is critical to do so.



If you do something that violates what the connector requires, you own the scrap.



Thanks and Best Regards,



Gerry Gagnon

Supplier Quality Manager



FLIR Systems, Inc.

9 Townsend W, Nashua, NH 03063 USA<x-apple-data-detectors://1/1>

Direct: +1 603 324 7895<tel:+1%20603%20324%207895>  |  Mobile: +1 781 366 5943<tel:+1%20781%20366%205943>

Email: [log in to unmask]<mailto:[log in to unmask]> |  www.flir.com<http://www.flir.com/>



The World’s Sixth Sense®



On Feb 22, 2018, at 1:21 PM, Stadem, Richard D <[log in to unmask]<mailto:[log in to unmask]>> wrote:



What does the mating connector drawing recommend?



-----Original Message-----

From: [log in to unmask]<mailto:[log in to unmask]> [mailto:[log in to unmask]]

Sent: Thursday, February 22, 2018 12:04 PM

To: [log in to unmask]<mailto:[log in to unmask]>; Stadem, Richard D

Cc: [log in to unmask]<mailto:[log in to unmask]>

Subject: RE: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer



Dell - Internal Use - Confidential



The DDR3 DIMM before me are 0.047 inch with a chamfer.



Victor,



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D

Sent: Thursday, February 22, 2018 11:56 AM

To: [log in to unmask]<mailto:[log in to unmask]>

Subject: Re: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer



Yup, I agree.



-----Original Message-----

From: Yuan-chia Joyce Koo [mailto:[log in to unmask]]

Sent: Thursday, February 22, 2018 11:41 AM

To: TechNet E-Mail Forum; Stadem, Richard D

Subject: Re: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer



majority of connector damage is due to mismatch thickness (too thick).  Normal proper singulation is not a problem for the edge - monitor the dust and damage... you don't want any thing fall into the connector matting area), except some manual cuts or other cheap version of cut-off edge methods NA usually don't see.

(problem start observe in mid 90s... on imported PWB... not only edge but stacking thickness too... you find out core thickness variation causes overall stack thickness problem - connector damage)... If my memory serve me right, the qual board were OK within spec.. the subsequent shipment got problem... the vendor collect the order and farm out to other shops... (of course, he lost the contract after batch variation were found with different date code - thanks god the date code was one of the traceable clue)...  for your reference only.

jk

On Feb 22, 2018, at 12:26 PM, Stadem, Richard D wrote:



And to add to Steve's posting, I believe it is optional because

usually DIMM cards are .031" thick, sometimes even .010", so if the

mating connector can handle that, then why bevel?



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory

Sent: Thursday, February 22, 2018 10:17 AM

To: [log in to unmask]<mailto:[log in to unmask]>

Subject: Re: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer



Victor,



JEDEC is the organization that defines mechanical specifications for

DIMM modules, not the IPC. All of the design specifications for the

different modules (DDR3, DDR4, DDR5, etc.) show a beveled edge but the

notes say that it is optional. All you have to do is take some time

and register yourself on the JEDEC page, and you can see every one of

the design specifications for free.



Steve



On Thu, Feb 22, 2018 at 8:38 AM, <[log in to unmask]<mailto:[log in to unmask]>> wrote:



Dell - Internal Use - Confidential



Fellow TechNetters:



  Is there an consensus out there whether the gold finger edge on

DDR3

DIMM Modules be beveled/Coined/Chamfer.   I would appreciate any

comments/remarks on this topic.



Victor,



-----Original Message-----

From: Hernandez, Victor G

Sent: Wednesday, February 21, 2018 1:10 PM

To: TechNet <[log in to unmask]<mailto:[log in to unmask]>>

Cc: Hernandez, Victor G <[log in to unmask]<mailto:[log in to unmask]>>

Subject: FW: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/

Chamfer



Fellow TechNetters:



  Any additional comments and/or concern over the gold finger edge

being

Beveled/Coined/Chamfered.   Many a times do I see socket with gold

plated

wire contact gouges from DIMM product that has not been

beveled/Coined/Chamfered, even bent pins.



Victor,



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Jose A Rios

Sent: Wednesday, February 21, 2018 8:15 AM

To: [log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]>

Subject: Re: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/

Chamfer



I don't know of a fully fledged std for it, other than workmanship

acceptance criteria in 6012 and possibly mentions of design guidance

in 2221



Sent from my iPhone



On Feb 21, 2018, at 8:57 AM, "[log in to unmask]<mailto:[log in to unmask]><mailto:

[log in to unmask]<mailto:[log in to unmask]>>" <[log in to unmask]<mailto:[log in to unmask]><mailto:

[log in to unmask]<mailto:[log in to unmask]>>> wrote:



Fellow TechNetters:



 Does IPC still have a STD for the above stated processt?   If

so, can

someone direct me to the document.



Victor,









--

Steve Gregory

Kimco Design and Manufacturing

Process Engineer

(208) 322-0500 Ext. -3133



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