Fwiw, we put our thermal stress/lot acceptance stuff like this in a PWB supplier Quality Rqmts Document (minimize clutter on fab drawings).    PO, drawing or stand alone document -- all work. Just a matter of style preferred.

We also have a section in that document outlining our basic qualification/reliability demonstration requirements (with some weasel words/disclaimers about it being a TBD on a case by case basis. Depends on specific end use case & class of product a qual effort is being used for).  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Craig Sullivan
Sent: Friday, February 2, 2018 5:50 AM
To: [log in to unmask]
Subject: [TN] Thermal Stressing PCB per TM-650 2.6.27

Hi All, 

 

I am wondering about thermal stress testing per IPC-TM-650 2.6.27 (260° reflow profile 6x) as one of the requirements in IPC-6012

 

For Assemblers:

Do you require this of all fab houses you buy from?

Do you request your customer add it to the FAB drawing?

 

For Fab Houses:

Do you automatically do this as part of your QC plan ?

How often? Per lot? Per Date Code? Etc.

Do you only do it when requested?

Do you require it to be on the fab drawing or could a CM flow it down through the PO even though the fab drawing is from the end customer?

Material depending, would you run 260° even if it was not a lead-free PCB?

 

Any other comments welcomed.

 

Craig Sullivan

Manufacturing Engineer

IT Administrator

Phone:  (607) 266-0480 x115

Fax:  (607) 266-0482

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