And to add to Steve's posting, I believe it is optional because usually DIMM cards are .031" thick, sometimes even .010", so if the mating connector can handle that, then why bevel?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Thursday, February 22, 2018 10:17 AM
To: [log in to unmask]
Subject: Re: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer
Victor,
JEDEC is the organization that defines mechanical specifications for DIMM modules, not the IPC. All of the design specifications for the different modules (DDR3, DDR4, DDR5, etc.) show a beveled edge but the notes say that it is optional. All you have to do is take some time and register yourself on the JEDEC page, and you can see every one of the design specifications for free.
Steve
On Thu, Feb 22, 2018 at 8:38 AM, <[log in to unmask]> wrote:
> Dell - Internal Use - Confidential
>
> Fellow TechNetters:
>
> Is there an consensus out there whether the gold finger edge on DDR3
> DIMM Modules be beveled/Coined/Chamfer. I would appreciate any
> comments/remarks on this topic.
>
> Victor,
>
> -----Original Message-----
> From: Hernandez, Victor G
> Sent: Wednesday, February 21, 2018 1:10 PM
> To: TechNet <[log in to unmask]>
> Cc: Hernandez, Victor G <[log in to unmask]>
> Subject: FW: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer
>
> Fellow TechNetters:
>
> Any additional comments and/or concern over the gold finger edge being
> Beveled/Coined/Chamfered. Many a times do I see socket with gold plated
> wire contact gouges from DIMM product that has not been
> beveled/Coined/Chamfered, even bent pins.
>
> Victor,
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Jose A Rios
> Sent: Wednesday, February 21, 2018 8:15 AM
> To: [log in to unmask]<mailto:[log in to unmask]>
> Subject: Re: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer
>
> I don’t know of a fully fledged std for it, other than workmanship
> acceptance criteria in 6012 and possibly mentions of design guidance
> in 2221
>
> Sent from my iPhone
>
> > On Feb 21, 2018, at 8:57 AM, "[log in to unmask]<mailto:
> [log in to unmask]>" <[log in to unmask]<mailto:
> [log in to unmask]>> wrote:
> >
> > Fellow TechNetters:
> >
> > Does IPC still have a STD for the above stated processt? If so, can
> someone direct me to the document.
> >
> > Victor,
>
>
--
Steve Gregory
Kimco Design and Manufacturing
Process Engineer
(208) 322-0500 Ext. -3133
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