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Subject:	Re: FW: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer
From:	Gerry Gagnon <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Gerry Gagnon <[log in to unmask]>
Date:	Wed, 21 Feb 2018 19:41:21 +0000
Content-Type:	text/plain
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Victor,



The the connector technical specification should lead you to some interesting insights!



Good hunting. 



Gerry



> On Feb 21, 2018, at 2:09 PM, "[log in to unmask]" <[log in to unmask]> wrote:

> 

> Dell - Internal Use - Confidential  

> 

> Fellow TechNetters:

> 

>   Any additional comments and/or concern over the gold finger edge being Beveled/Coined/Chamfered.   Many a times do I see socket with gold plated wire contact gouges from DIMM product that has not been beveled/Coined/Chamfered, even bent pins.

> 

> Victor,

> 

> -----Original Message-----

> From: TechNet [mailto:[log in to unmask]] On Behalf Of Jose A Rios

> Sent: Wednesday, February 21, 2018 8:15 AM

> To: [log in to unmask]

> Subject: Re: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer

> 

> I don’t know of a fully fledged std for it, other than workmanship acceptance criteria in 6012 and possibly mentions of design guidance in 2221

> 

> Sent from my iPhone

> 

>> On Feb 21, 2018, at 8:57 AM, "[log in to unmask]" <[log in to unmask]> wrote:

>> 

>> Fellow TechNetters:

>> 

>>  Does IPC still have a STD for the above stated processt?   If so, can someone direct me to the document.

>> 

>> Victor,

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