TECHNET Archives

February 2018

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 21 Feb 2018 19:09:32 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines)
Dell - Internal Use - Confidential  



Fellow TechNetters:



   Any additional comments and/or concern over the gold finger edge being Beveled/Coined/Chamfered.   Many a times do I see socket with gold plated wire contact gouges from DIMM product that has not been beveled/Coined/Chamfered, even bent pins.



Victor,



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Jose A Rios

Sent: Wednesday, February 21, 2018 8:15 AM

To: [log in to unmask]

Subject: Re: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer



I don’t know of a fully fledged std for it, other than workmanship acceptance criteria in 6012 and possibly mentions of design guidance in 2221



Sent from my iPhone



> On Feb 21, 2018, at 8:57 AM, "[log in to unmask]" <[log in to unmask]> wrote:

> 

> Fellow TechNetters:

> 

>   Does IPC still have a STD for the above stated processt?   If so, can someone direct me to the document.

> 

> Victor,


ATOM RSS1 RSS2